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G.Skill launches new Flare X5X DDR5 memory with EXPO Ultra Low Latency

G.Skill's new Flare X5X DDR5 memory series debuts with a DDR5-6000 CL36-36-36-76 32GB (2x16GB) kit optimized for AMD platforms. It supports EXPO Ultra Low Latency (ULL) profiles with additional sub-timing adjustments to reduce latency. The modules have a low-profile heatspreader without RGB. Pricing varies due to market conditions.

news / memory · ddr5, expo, flare-x5x

KitGuru08/31AI signal 78 of 100, published 08/31

tomshardware.com

source

China's CXMT beats Western chipmakers to announcement of LPDDR6 mass production — Xiaomi smartphones to debut industry’s first LPDDR6 chips

CXMT says it has begun mass production of LPDDR6 for a Xiaomi smartphone, making it among the first to commercialize the new low-power memory standard. Tom's Hardware notes the achievement narrows the gap with Samsung, SK hynix, and Micron, but the rollout covers just one model and performance is undisclosed; high-yield volume production across the market remains unproven.

news / memory · cxmt, lpddr6, ram

Tom's Hardware08/31AI signal 78 of 100, published 08/31

techpowerup.com

source

CXMT Starts Risk Production of HBM3E Memory

Chinese memory maker CXMT has begun risk production of HBM3E memory, two generations behind South Korean rivals. Standard JEDEC spec includes 1.2 TB/s bandwidth and 24-36 GB capacities.

news / memory · cxmt, dram, hbm

TechPowerUp News08/31AI signal 73 of 100, published 08/31

wccftech.com

source

Samsung Locks 70% of Memory Capacity Into 2031 Deals – Long-Term HBM Deals Run 5x Cheaper Than Spot, as AI Demand Chokes the DRAM Market

According to SEDaily, Samsung has booked 70% of its memory capacity for long-term HBM agreements, primarily with big tech firms like Microsoft, Google, and NVIDIA. These LTAs are significantly cheaper than HBM spot prices, which are elevated due to AI demand and DRAM tightness.

news / memory · hbm, nvidia, ram

Wccftech08/31AI signal 72 of 100, published 08/31

techpowerup.com

source

SK hynix Eyes Intel Foundry for HBM4E Base Die Manufacturing

The South Korean Herald reports that SK hynix is considering Intel Foundry as a second supplier for HBM4E base dies, alongside TSMC. This would allow custom logic on the base die. The article is based on a rumor but has a credible source.

news / memory · hbm, intel, memory

TechPowerUp News08/31AI signal 69 of 100, published 08/31

guru3d.com

source

G.SKILL Launches Flare X5X DDR5-6000 Memory With AMD EXPO ULL

G.SKILL has introduced the Flare X5X series, a new DDR5 desktop memory line for compatible AMD platforms. The first offering is a 32 GB kit (2x16 GB) rated at DDR5-6000 with CL36-36-36-76 timings and AMD EXPO support.

news / memory · amd, ddr5, gskill

Guru3D08/31AI signal 68 of 100, published 08/31

guru3d.com

source

Micron Taiwan Workers Move Toward Possible Strike as Global DRAM and HBM Supplies Remain Tight

The global memory market faces another supply-chain risk as workers at Micron's Taiwan operations move toward formal labor negotiations that could lead to a strike. This adds to concerns about DRAM and HBM availability.

news / memory · micron, ram

Guru3D08/31AI signal 68 of 100, published 08/31

tomshardware.com

source

G.Skill drops new AMD EXPO ULL RAM for Ryzen CPUs — Flare X5X brings new ULL optimized subtimings, but pricing remains a mystery

G.Skill introduces the Flare X5X series of DDR5-6000 RAM kits designed for AMD Ryzen processors with EXPO ULL technology. The 32GB (2x16GB) kit has timings of 36-36-36-96 at 1.35V, matching standard Flare X5 but with tighter subtimings. Pricing is unknown but expected around $509.99 based on similar models.

news / memory · amd, ddr5, expo

Tom's Hardware08/31AI signal 66 of 100, published 08/31

guru3d.com

source

SK hynix Disputes Report That Intel Could Manufacture HBM Base Dies

SK hynix responded to reports that it is considering Intel Foundry as an external supplier for HBM base dies, saying parts of the story are inaccurate. The company's statement clarifies its position on this potential manufacturing partnership.

news / memory · intel, ram, sk-hynix

Guru3D08/31AI signal 64 of 100, published 08/31

techpowerup.com

source

CXMT Officially Starts Mass Production of LPDDR6 Memory

CXMT has begun mass production of LPDDR6 memory, operating at up to 12.8 Gbps with 16 Gb (2 GB) capacity. Xiaomi will use it in the upcoming Xiaomi 18 Fold. The article is a well-sourced industry announcement about a new RAM technology.

news / memory · cxmt, lpddr6, memory

TechPowerUp News08/29AI signal 80 of 100, published 08/29