CXMT Starts Risk Production of HBM3E Memory
Chinese memory maker CXMT has begun risk production of HBM3E memory, two generations behind South Korean rivals. Standard JEDEC spec includes 1.2 TB/s bandwidth and 24-36 GB capacities.
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CXMT, China's largest DRAM manufacturer, filed a lawsuit against the Pentagon and Defense Secretary Pete Hegseth over its Section 1260H list placement. The company says the designation is arbitrary and lacks evidence, noting its chips meet JEDEC commercial standards. It alleges a February removal notice was withdrawn the same day without explanation.
G.Skill drops new AMD EXPO ULL RAM for Ryzen CPUs — Flare X5X brings new ULL optimized subtimings, but pricing remains a mystery
G.Skill introduces the Flare X5X series of DDR5-6000 RAM kits designed for AMD Ryzen processors with EXPO ULL technology. The 32GB (2x16GB) kit has timings of 36-36-36-96 at 1.35V, matching standard Flare X5 but with tighter subtimings. Pricing is unknown but expected around $509.99 based on similar models.
With The HBM Base Die Costing 3-4x As Much As The Core Die, NVIDIA’s NVHBM Is A Master Stroke For Capturing Most Of The HBM Value While Relegating The ‘Big Three’ To The Commodity Status
This analysis discusses NVIDIA's NVHBM (NVIDIA HBM) approach, which involves a base die costing 3-4 times as much as the core die. NVIDIA aims to capture most of the HBM value chain, reducing the 'Big Three' memory makers to commodity suppliers. The article also mentions SK hynix evaluating relocation of HBM base die fabrication.
MacBook Neo Burns Through SSD Cycles At An Alarming Rate
UFD Tech found that the MacBook Neo's 256GB SSD could have a lifespan of 414 TB due to swap usage. In a three-hour test, nearly 900GB was written to the SSD. The 512GB version has a higher projected lifespan.