SK hynix Eyes Intel Foundry for HBM4E Base Die Manufacturing
The South Korean Herald reports that SK hynix is considering Intel Foundry as a second supplier for HBM4E base dies, alongside TSMC. This would allow custom logic on the base die. The article is based on a rumor but has a credible source.
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G.Skill introduces the Flare X5X series of DDR5-6000 RAM kits designed for AMD Ryzen processors with EXPO ULL technology. The 32GB (2x16GB) kit has timings of 36-36-36-96 at 1.35V, matching standard Flare X5 but with tighter subtimings. Pricing is unknown but expected around $509.99 based on similar models.
Chuwi UniBook Wildcat Lake 304 “Intel Core 3 304” Laptop Review – $449 MacBook Neo Competitor Worth It?
Chuwi's UniBook laptop, priced at $449, uses Intel's Wildcat Lake Core 3 304 SoC. The review examines the performance of this entry-level chip in a laptop, comparing it to a MacBook Neo. The article includes hands-on testing and measured results from the review.
CXMT Starts Risk Production of HBM3E Memory
Chinese memory maker CXMT has begun risk production of HBM3E memory, two generations behind South Korean rivals. Standard JEDEC spec includes 1.2 TB/s bandwidth and 24-36 GB capacities.
Key Nvidia and Intel supplier raided over alleged China origin fraud — Unimicron faces probe over PCB origin washing, risk of 40% U.S. tariff penalty
Unimicron, a major PCB and chip substrate supplier to Nvidia, Intel, Google, and Amazon, is under investigation in Taiwan for allegedly shipping China-made PCBs to Taiwan, relabeling them, and selling them as Taiwanese products. Prosecutors raided its HQ and plant, questioned 14 suspects, and set bail. The case could trigger U.S. Customs' 40% transshipment penalty on qualifying imports, though the involved products appear to be conventional PCBs rather than advanced ABF substrates.