SK hynix Disputes Report That Intel Could Manufacture HBM Base Dies
SK hynix responded to reports that it is considering Intel Foundry as an external supplier for HBM base dies, saying parts of the story are inaccurate. The company's statement clarifies its position on this potential manufacturing partnership.
Related Hardware News
AI CuratedChina's Top DRAM Maker CXMT Takes Pentagon to Court Over Military Blacklist
CXMT, China's largest DRAM manufacturer, filed a lawsuit against the Pentagon and Defense Secretary Pete Hegseth over its Section 1260H list placement. The company says the designation is arbitrary and lacks evidence, noting its chips meet JEDEC commercial standards. It alleges a February removal notice was withdrawn the same day without explanation.
G.Skill drops new AMD EXPO ULL RAM for Ryzen CPUs — Flare X5X brings new ULL optimized subtimings, but pricing remains a mystery
G.Skill introduces the Flare X5X series of DDR5-6000 RAM kits designed for AMD Ryzen processors with EXPO ULL technology. The 32GB (2x16GB) kit has timings of 36-36-36-96 at 1.35V, matching standard Flare X5 but with tighter subtimings. Pricing is unknown but expected around $509.99 based on similar models.
Chuwi UniBook Wildcat Lake 304 “Intel Core 3 304” Laptop Review – $449 MacBook Neo Competitor Worth It?
Chuwi's UniBook laptop, priced at $449, uses Intel's Wildcat Lake Core 3 304 SoC. The review examines the performance of this entry-level chip in a laptop, comparing it to a MacBook Neo. The article includes hands-on testing and measured results from the review.
With The HBM Base Die Costing 3-4x As Much As The Core Die, NVIDIA’s NVHBM Is A Master Stroke For Capturing Most Of The HBM Value While Relegating The ‘Big Three’ To The Commodity Status
This analysis discusses NVIDIA's NVHBM (NVIDIA HBM) approach, which involves a base die costing 3-4 times as much as the core die. NVIDIA aims to capture most of the HBM value chain, reducing the 'Big Three' memory makers to commodity suppliers. The article also mentions SK hynix evaluating relocation of HBM base die fabrication.