Apple Wins An Implied Reprieve As Kioxia CEO Declares NAND “Prices Have Risen Enough”
In a rare move, Kioxia CEO Hiroo Ota has told sales teams to avoid substantially higher prices, particularly for data centers, which likely extends to Apple as a major customer. The gesture offers Apple some relief in NAND flash pricing.
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Wccftech reports on an experimental port of NVIDIA's DLSS 5 to Apple's M5 Pro. Image quality improves dramatically, but the lack of dedicated FP8 hardware causes severe performance and latency penalties versus a desktop RTX 5050.
(PR) LattePanda Launches the LattePanda Mu Ultra: A Micro x86 Compute Module for On-Device AI
LattePanda announced the LattePanda Mu Ultra, a micro x86 compute module for on-device AI powered by Intel Core Ultra 5 226V and Ultra 7 256V processors. It delivers up to 115 TOPS in a 69.6mm x 60mm form factor, targeting robotics, industrial automation, portable instruments, vision AI, and edge applications. The press release focuses on positioning and target markets.
Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change
Samsung and TSMC said they will adopt ASML's high-NA EUV lithography machines, which cost up to $400 million each, and joined Intel in accepting a technology change to boost output by 40%. The move could enable smaller, more efficient chips for AI and consumer devices.
Intel Leaps 2-4 Years Ahead Of Samsung And TSMC On High-NA EUV Lithography After Producing Its 1 Millionth Test Wafer
According to UBS, Intel's progress on high-NA EUV lithography and EMIB-T advanced packaging puts it ahead of Samsung and TSMC by 2-4 years. Intel has produced its 1 millionth test wafer, and UBS believes it can meet MediaTek's growing TPU demand for EMIB-T packaging, with capacity to package over 2 million substrates by 2028. The industry is increasingly optimistic about Intel's execution and yields.