Intel Leaps 2-4 Years Ahead Of Samsung And TSMC On High-NA EUV Lithography After Producing Its 1 Millionth Test Wafer
According to UBS, Intel's progress on high-NA EUV lithography and EMIB-T advanced packaging puts it ahead of Samsung and TSMC by 2-4 years. Intel has produced its 1 millionth test wafer, and UBS believes it can meet MediaTek's growing TPU demand for EMIB-T packaging, with capacity to package over 2 million substrates by 2028. The industry is increasingly optimistic about Intel's execution and yields.
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