CXMT Faces HBM Memory Chip Shock As Yields Sink To 25% With Close To 80 Out Of 100 HBM3 Chips Failing Final Tests, Says Report
According to a Korean media report, Chinese memory manufacturer CXMT is struggling with HBM memory chip production, specifically with Through Silicon Vias (TSVs) and stacking, resulting in yields as low as 25% for HBM3 chips. The firm has been focusing on DRAM modules while major manufacturers shift to HBM, but its own HBM efforts are facing significant challenges.
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