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Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor

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Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Key Takeaway

Samsung outlined a plan to evolve HBM into integrated memory-and-compute, starting with HBM4's 4nm base die, then custom HBM (cHBM), advanced HBM (aHBM), and finally zHBM with the processor under the DRAM stack.

AI Summary & Analysis
Samsung revealed a three-phase HBM roadmap at Hot Chips 2026, culminating in zHBM stacking DRAM directly on top of the processor.
Original Source Coverage
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Related Topics:
#hbm#ram#samsung

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