The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
Tom's Hardware examines the state of hybrid bonding in 2026: TSMC's SoIC pitch roadmap from 9 to 6 microns with 4.5-micron by 2029, Intel's Foveros Direct in volume on Clearwater Forest, and AMD's use in 3D V-Cache and MI300. A JEDEC decision raising HBM stack height lets HBM4 stay on microbumps, deferring hybrid bonding in memory to HBM4E and HBM5, while memory makers build advanced packaging capacity ahead of deployment.
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