Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs
Intel announced it has surpassed one million 300mm wafers processed using High-NA EUV scanners, more than the rest of the industry combined. The company is also working on 6x12-inch photomasks to enable full-field exposure without stitching, potentially giving Intel a first-mover advantage in projection lithography standards.
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